Basic solving and Post-Processing in Icepak

Опубликовано: 11 Октябрь 2024
на канале: Ozen Engineering, Inc
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Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides robust electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. In this video, we will discuss the generation of a conformal mesh and its size control parameters.