Thermal PCB Design Tips - Phil's Lab #93

Опубликовано: 29 Октябрь 2024
на канале: Phil’s Lab

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Thermal considerations when designing hardware and PCBs. Including discussions on trace widths, planes, copper thickness, power calculations, regulator and package choice, and more.

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[TIMESTAMPS]
00:00 Introduction

00:37 Altium Designer Free Trial

01:16 Trace/Plane Width and Thickness
02:41 IPC-2221 Calculator
06:07 Paralleling Layers
07:03 LDO Power Dissipation
09:42 Package Choice (Thermal Resistance)
13:15 Thermal Vias and Pads
17:59 Thermal Reliefs and Copper Balancing

18:55 Summary
20:42 Outro