Explore what’s new in Ansys Electronics 2026 R1 with Rand SIM expert Anna Scovill. This highlight covers HFSS GPU acceleration using cuDSS, advanced 3D Power Integrity analysis for next-generation chip-package designs, and the new Component 2.0 workflow for streamlined multiphysics simulation. Learn how these updates improve performance, scalability, and design consistency across EM and thermal analysis.
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