Building an Open Chiplet Economy

OCP TAP - TSIAW Workstream call (Sep 02, 2024)

OCP CE - Heat Reuse Workstream call (Aug 01, 2024)

OCP CE - Heat Reuse Workstream call (Aug 08, 2024)

OCP CE - Advanced Cooling Facilities Sub-project call (Aug 13, 2024)

OCP CE - Advanced Cooling Facilities Sub-project call (Sep 03, 2024)

OCP CE - Advanced Cooling Facilities Sub-project call (Aug 06, 2024)

2023 OCP Hardware Management Tech Talks

2023 OCP Storage Tech Talks

Loop Heat Pipe for Modular Data Centers

Compute and thermal performance of repurposed OCP hardware from air to liquid

Latest revision of the Cold Plate Cooling Loop Requirements

Panel: Coolant Temperatures for Durable Data Center Designs

Immersion-Signal Integrity

Immersion Community Update

An Update on Caliptra

Data Center Modular Hardware System (DC-MHS) Overview & Update

The Next Evolution of Meta’s Compute Server Platform with Crater Lake, Yosemite V3.5 & Open Rack V3

Ampere® Altra® Family Mt. Bonnell - Compelling Performance for a Carbon Neutral Future

Accelerating infrastructure with Data Processing Units (DPU)

SONiC Lite: How to fit SONiC into a "small" box

Scaling Remote direct memory access (RDMA) networks for AI Training

Empowering the Industry with Open System Firmware

Data Center Secure Control Module (DC-SCM) 2.0 Compliance Testing with OpenBMC

Efficiency Improvements and Other Developments in ORv3 Power Solutions