Following the trail blazed by Google's TPU and Amazon's Trainium, Microsoft has officially unveiled its second-generation inference powerhouse. Built on TSMC's 3nm process, the Maya 200 packs 140+ billion transistors, 216 GB of HBM3E, and a massive 272 MB of on-chip SRAM to tackle the efficiency crisis in real-time inference.
Press release: https://blogs.microsoft.com/blog/2026...
Maia 200 Preview: https://aka.ms/Maia200SDK
[0:00] Who makes hardware
[0:43] Hyperscaler silicon
[2:47] Microsoft
[3:20] Cobalt 200
[3:44] Maia 200
[5:32] Performance
[8:54] Networking and scale-up design
[10:12] Rack-scale architecture
[13:02] Monolithic vs chiplet design
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