KL 558 flux solder,Halogen-free, ROSH certified, mobile phone repair, BGA and QFN chip repair
Product Overview
KL 558 Flux Solder is a high-performance halogen-free soldering paste (or solder paste) specifically designed for BGA (Ball Grid Array) and QFN (Quad Flat No-lead) chip repairs. It complies with environmental standards and is ideal for mobile phone repairs, precision electronics, and scenarios requiring high reliability and precision in soldering.
Key Features
Halogen-Free Formula
Contains no halogens (chlorine, bromine, etc.), minimizing toxic emissions and meeting strict environmental requirements for electronics manufacturing.
RoHS Certified
Compliant with the EU RoHS Directive (Restriction of Hazardous Substances), ensuring no lead, cadmium, mercury, or other harmful materials.
High Solder Reliability
Excellent wettability and thermal stability reduce risks of cold joints or voids, making it ideal for BGA rework stations and QFN chip soldering under high-temperature reflow processes.
Low Residue & No-Clean
Leaves minimal transparent residue after soldering, non-corrosive, and typically requires no post-cleaning, saving time in repairs.
Broad Compatibility
Works with both lead-free and leaded solder alloys, adapts to varied temperature profiles, and suits precision components like smartphone motherboards and microchips.
Typical Applications
Mobile Device Repairs: BGA reballing/replacement (e.g., CPUs, GPUs, baseband chips).
QFN Chip Soldering: RF modules, power management ICs, and other leadless packages.
Precision Electronics: Laptops, wearables, automotive electronics, and micro-solder joint repairs.
Technical Specifications (Example)
Flux Type: RMA (Rosin Mildly Activated) – balances cleaning power and safety.
Melting Range: Adjustable based on alloy (e.g., SAC305 alloy melts at 217–220°C).
Viscosity: Suitable for syringe dispensing or stencil printing.
Storage: 5–10°C refrigeration recommended; avoid humidity and high temperatures.
Usage Guidelines
Preparation: Clean pads thoroughly to remove oxidation.
Application: Apply solder paste evenly on BGA pads or QFN contacts.
Placement: Align and position the chip accurately.
Reflow Soldering: Follow a temperature profile (e.g., 150°C → 220°C → cooling) using a hot air station or rework machine.
Inspection: Verify joints via X-ray or microscope for quality assurance.
Important Notes
Stir the paste thoroughly before use to ensure uniformity.
Reseal and refrigerate after opening to prevent flux evaporation or degradation.
Maintain ventilation during soldering to avoid inhaling fumes.
For detailed technical datasheets or certifications, contact the supplier directly. This product is a must-have for professional electronics repair technicians! 🔧📱
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