ANSYS FLUENT Training: IGBT Heat Sink Cooling CFD Simulation
https://www.mr-cfd.com/shop/igbt-heat...
In this project, the cooling of an IGBT heat sink is simulated. The heat sink is in contact with a heat source (with the heat flux of 14583 W/m2) on one side and the air flows on the other side with a mass-flow of 0.25Kg/s. The air-flow is responsible for cooling the heat sink. Energy model is activated to analyze the heat transfer rate and the Laminar viscous model is activated to solve the air-flow.
An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device primarily used as an electronic switch. An IGBT generates significant heat and can be affected by excess thermal energy. Using air cooling or liquid cooling techniques, e.g. heat sinks, this excessive heat can be removed, which can lead to improved performances, thus enabling much higher power densities and more compact modules.