The LPKF Fusion3D is fully equipped for the laser-structuring of molded interconnect devices (MID). More info: https://www.lpkf.com/en/industries-te...
This laser machine structures complex 3D electronic components (MID) from multiple sides - with up to four laser heads simultaneously. This reduces laser structuring time and eliminates the time needed for rotating the components.
Download our 3D-MID design rules for developers:https://en.lpkf.com/knowledge-center/...
3D-MID High Volume Production