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OCP TAP - TSIAW Workstream call (Sep 02, 2024)
OCP CE - Heat Reuse Workstream call (Aug 01, 2024)
OCP CE - Heat Reuse Workstream call (Aug 08, 2024)
OCP CE - Advanced Cooling Facilities Sub-project call (Aug 13, 2024)
OCP CE - Advanced Cooling Facilities Sub-project call (Sep 03, 2024)
OCP CE - Advanced Cooling Facilities Sub-project call (Aug 06, 2024)
2023 OCP Hardware Management Tech Talks
2023 OCP Storage Tech Talks
Loop Heat Pipe for Modular Data Centers
Compute and thermal performance of repurposed OCP hardware from air to liquid
Latest revision of the Cold Plate Cooling Loop Requirements
Panel: Coolant Temperatures for Durable Data Center Designs
Immersion-Signal Integrity
Immersion Community Update
An Update on Caliptra
Data Center Modular Hardware System (DC-MHS) Overview & Update
The Next Evolution of Meta’s Compute Server Platform with Crater Lake, Yosemite V3.5 & Open Rack V3
Ampere® Altra® Family Mt. Bonnell - Compelling Performance for a Carbon Neutral Future
Accelerating infrastructure with Data Processing Units (DPU)
SONiC Lite: How to fit SONiC into a "small" box
Scaling Remote direct memory access (RDMA) networks for AI Training
Empowering the Industry with Open System Firmware
Data Center Secure Control Module (DC-SCM) 2.0 Compliance Testing with OpenBMC
Efficiency Improvements and Other Developments in ORv3 Power Solutions