Solving the Interconnect Density Bottleneck in 51.2T Switches
With the first generation of 51.2T switches running at 100 Gbps per lane on the horizon, the market will be considering the pros and cons of different board design choices for managing so many high capacity channels. Will co-packaged optics (CPO) or near-packaged optics (NPO) scale to meet the bandwidth density challenge? Dr. Rebecca K. Schaevitz, COBO Board Member and Principal Engineer/Product Line Manager at Broadcom, will discuss the the potential for SiPh Chiplets In Package (SCIP) optical engines for driving next-generation data center connectivity. Tom Mitcheltree, Advanced Technology Manager for US Conec, discusses connector embodiment packages based on standardized and custom optical interconnect ferrules.