5G MEETS A STRAIN GAUGE SENSOR.
When you wake up you will probably reach for your phone to enable notifications; some phones have strain gauged beams inside the phone to detect squeezing. The internal components (PCBA, Printed Circuit Board Assembly) would have been tested for reliability during the production process using strain gauges. If you’ve ever dropped your phone and found that it still works perfectly, you should thank the engineers who used the drop-test method with strain gauges (and other sensors) to ensure survivability.
PCBs designed for 5G applications will require a new mix of analog and digital components capable of operating at very high frequencies and data rates, whose reliability and efficiency can only be guaranteed through effective thermal and mechanical stress tests .
Strain gauges are the primary tool for evaluating these processes to ensure that the device does not see any input that could initiate a micro-facture. These so-called latent failures mean that a device will work perfectly well until some minor event causes the fracture to propagate. Premature failure can lead to significant warranty claims or loss of customer confidence.
Micro-Measurements: https://micro-measurements.com/
Advanced Sensors Technology: https://micro-measurements.com/advanc...