You can see it on the packaging of all our coolers: TDP. This “Thermal Design Power” describes the thermal power loss created by the CPU which can be dissipated by the heat spreader of the cooler. So this TDP numbers gives you a very good idea of the performance of the CPU cooler, which is a good thing. But, what not everybody may know: There are several definitions of TDP.
Detailed explanation of the formula:
We define the heat flow φ in Watts by the heat energy dissipated from the cooler, at a temperature difference in Kelvin between ambient temperature and IHS temperature, as TDP. This temperature difference is usually in the range of 20-25 Kelvin. In this case, the cooler can be considered as thermal resistance Rth under given environmental conditions, which we replicate with our test conditions (contact surface between CPU cooler and CPU, ambient temperature, fan speed, etc.) The cooler’s thermal resistance is determined in our tests. Thus, the result is ΔT / Rth = φ
The most important thing is to bring the test conditions as close to reality as possible in order to obtain usable results and not disappoint our customers. For example, the requirement for the cooler will be stricter for higher TDPs, as CPUs with higher heat density also place higher demands on the cooler.
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