Semiconductor Wafer Handling Automation Demo
Our WaferMate Series Automated wafer handling platform delivers wafer handling for standard and non-standard wafers and substrates.
This automated wafer handling system integrated a DEK printer process tool and demonstrates the handling of 200mm thin warped wafers during the backside coating process.
Featuring:
• DEK Screen Printer Process Tool Integration
• 200mm Thin Wafer Handling
Interested in learning more about our wafer handling capabilities?
Visit our website to learn more:
https://bit.ly/3bQ1Z6o