200G per lane 1.6T Technology Demonstration
Using Tru-SiPh (TM) technology, a 200G/lane chip is demonstrated with TDECQ less than 1.1dB at only 1.15Vp-p drive. Intended for data center applications, this silicon photonics chip exceeds current requirements at the 200G node while simplifying assembly with integrated lasers and on-chip optical power monitoring. See more about Tru-SiPh (TM) at www.skorpiosinc.com