SDC2022 – Universal Chiplet Express: Accelerating the future of semiconductor innovations
Compute, memory, storage, and connectivity demands are forcing the industry to adapt as it meets the expanding needs of cloud, edge, enterprise, 5G, and high-performance computing. UCIe — Universal Chiplet Interconnect Express — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The organization is also fostering an open chiplet ecosystem by offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets. The UCIe 1.0 specification provides a fully defined stack that comprehends plug-and-play interoperability of chiplets on a package — similar to the seamless interplay on board with off-package interconnect standards such PCI Express®, Universal Serial Bus (USB)®, and Compute Express Link™ (CXL™). This presentation explores the industry demand that brought about the UCIe specification and shares how end-users can easily mix and match chiplet components provided by a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC.
Learning Objectives
Understand the usages and key metrics associated with the technology solutions provided by UCIe.
Explore the various layers and software models of UCIe along with compliance and interoperability mechanisms.
Gain insight into the evolution of UCIe allowing the incorporation of additional usage models.
Presented by Debendra Das Sharma, UCIe - Universal Chiplet Interconnect Express
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