Ravishankar Sethuraman, SVP - Head - 5G Engineering at HCLTech Explains Why TIP @ MWC23

Опубликовано: 16 Март 2026
на канале: Telecom Infra Project
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Ravishankar Sethuraman, SVP - Head - 5G Engineering at HCLTech has a discussion with Eugina Jordan, CMO of the Telcom Infra Project, and explains why they chose to sponsor TIP and have a pod at the TIP Pavilion at MWC23.