Packaging innovation for space applications - with Texas Instruments
Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments ( https://satsearch.com/suppliers/texas... ), about the packaging of electronic components for space.
In the episode we cover:
The benefits of using plastic packages vs. ceramic packaging
These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes
The role that Texas Instruments has played in supporting the standardization of QMLP
How and why TI will continue to offer QMLV-RHA (ceramic) packaging
How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities
You can find out more about Texas Instruments here on their satsearch supplier hub ( https://satsearch.com/suppliers/texas... ).
And if you would like to learn more about the space industry and our work at satsearch building the global marketplace for space, please join our newsletter ( https://satsearch.com/mailing-list ).
[Music from Uppbeat (free for Creators!): https://uppbeat.io/t/all-good-folks/w... License code: Y4KZEAESHXDHNYRA]
The Space Industry
Episode 62
April 18, 2024
★ Episode details: https://share.transistor.fm/s/28e9f46a
★ Additional episodes: https://satsearch.com