High-precision laser soldering with high miniaturization
Due to increasing miniaturization and ever higher packaging density, the demands on the individual production steps in the electronics industry are rising.
This also applies to the laser soldering of assemblies, where precise alignment of the laser is a guarantee for avoiding solder bridges and for highly accurate, reproducible soldering results.
Since miniaturization and increased packaging density are an unstoppable trend, laser soldering specialist EUTECT is cooperating with Jenoptik to ensure even more precise alignment of the laser for future applications.
More information: https://eutect.de/en/eutect-and-jenop...