5G Fanless Rugged Embedded Systems Improved AI Inferencing Performance, Accelerating AI Workloads
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Key Features
Onboard Intel Core i Processor ( Tiger Lake UP3)
Support 2 X 260-pin DDR4 SO-DIMM Sockets
Support 5G (sub-6G) module, M2.NVME SSD
Rich I/O: 4x COM/3xLAN/4x USB 3.2 G2 /Remote RPWR2
Support Triple-display (DVI-D/HDMI/DP)
Wide Power Input: 9~ 36VDC
Power on/off delay control/configurable ignition power control
Support DirectX 12
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