MicroLED Processing – Laser-Assisted Bonding
Learn how our laser technologies enable the manufacturing of next-gen microLED displays. Excimer lasers are key to performing the three vital processes in microLED fabrication – Laser Lift-Off (LLO), Laser-Induced Forward Transfer (LIFT), and Repair/Trimming while high-power infrared diode lasers are the perfect bonding solution and electrically connecting the dies to the substrate.
Discover how laser-assisted bonding bypasses one of the remaining roadblocks in volume microLED display production. https://bit.ly/4dgzjkv
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