HB600ZA SiC Wire Cutting Machine | Breakthrough in Silicon Carbide Processing by SSG Machine Tool
The HB600ZA SiC wire cutting machine by SSG Machine Tool is designed specifically for silicon carbide (SiC) processing.
It achieves breakthrough precision and stability, entering the Japanese market and reshaping the global semiconductor equipment industry.
Model: HB600ZA
Material: SiC
Workpiece Diameter: 360mm
Machining Time: 30 hours
Surface Roughness: Ra 1.2–1.8 μm
🔹 Key Advantages:
Optimized for SiC wafer cutting
Intelligent adaptive control & real-time monitoring
No chipping or micro-cracks
Smooth surface (Ra 1.2–1.8 μm)
Less than 1mm cutting thickness
Surface quality comparable to top Japanese and German brands
From “following” to “leading,” HB600ZA demonstrates the rise of Chinese semiconductor manufacturing and the innovation power of SSG Machine Tool.
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