How the ASIC Model for IP Can Encourage Multi-Die System Innovation

Опубликовано: 15 Октябрь 2024
на канале: EE Journal
853
5

You scream for IP. I scream for IP. We all scream for IP! In this week’s Fish Fry podcast, Manmeet Walia (Synopsys) and I investigate the evolution of IP and the role that IP will play in the future of multi-die systems. We also discuss why a shift in the semiconductor ecosystem is pushing a movement toward ASIC and COT models, the benefits of an ASIC model for IP, and how standards are helping accelerate innovation in multi-die systems.

Links:
What it Means for an IP Vendor to Offer ASIC-Like Services: http://bit.ly/3ZejKBX

How Bandwidth-Hungry Applications Are Changing Data Center Architectures: http://bit.ly/3YVAHBk 

The Path to 800G Ethernet: How Standards Are Paving the Way for Innovation: http://bit.ly/3IoPKwv

UCIe Heralds a Robust Chiplet Ecosystem for a New Era of SoC Innovation: http://bit.ly/3Kx4j3Y

Synopsys Interface IP: http://bit.ly/3YW266b