Achieving High Power Density with IGBT and SiC Power Modules -- Infineon and Mouser

Опубликовано: 25 Май 2026
на канале: EE Journal
40,503
107

May 19, 2023 -- Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.

More information about Infineon Technologies EconoDUAL™ 3 IGBT Modules: https://bit.ly/3pTGqLE
More information about Infineon Technologies IGBT7 E7 TRENCHSTOP™ Dual Configuration Modules: https://bit.ly/41Qzg83