Die Flipping with FINEPLACER® femto - Die Flipping Unit
Learn more about the system: https://www.finetech.de/products/rd-b...
Module integration for the automatic and material-friendly flipping of chips with various sizes and thicknesses. A typical field of application are chips presented with the bond side facing upward. The interchangeable platforms of the flipping unit allow for component-specific adaptation and can be approached with micron accuracy.