Multi-purpose Manual Die Bonder for Lab & Research - FINEPLACER® pico 2

Опубликовано: 28 Апрель 2026
на канале: Finetech
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The FINEPLACER® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, the system is ideal for fast and flexible product development and prototyping in R&D labs and universities.

0:00:00 Introduction
0:00:33 The new generation of the multi-purpose die bonder FINEPLACER® pico
0:01:07 Configuration for adhesive bonding in medical technologies
0:01:32 Configuration for soldering sensors used for the automotive industry
0:01:52 Configuration for thermocompression technologies to build MEMS-based sensors
0:02:04 Customization and flexible switching between bonding technologies
0:02:36 IPM Command bonding software
0:03:03 Prototype to Production

Product details: https://www.finetech.de/products/rd-b...

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About Finetech
Finetech is a leading global supplier of micro assembly and professional SMD rework equipment for customers involved in the development and manufacturing of opto- and microelectronics. Finetech’s die bonder systems, with up to 0.3 micron placement accuracy, support a wide range of advanced bonding technologies to implement the most precise and complex applications.

Finetech follows the “Prototype-to-Production” approach to support customers at the development stage and help them transition their processes into production. This makes Finetech equipment the perfect fit for flexible and cost-efficient product development and manufacturing.

The company serves a broad range of industries, including Datacom & Telecom, Industrial Semiconductor, Consumer Electronics, Medical, Aerospace & Avionics, Automotive, Defense & Security, Energy, as well as universities and research facilities. With subsidiaries on three continents and a global network of representatives, Finetech ensures quick response times, fast on-site service and personal consultation

https://www.finetech.de