3D printed liquid cooled heatsinks for power electronics applications

Technology Stage: Panel Discussion SiC Wide Bandgap, "The Future of Power" Part 2

Technology Stage: Panel Discussion SiC Wide Bandgap, "The Future of Power" Part 1

Technology Stage: Panel Discussion GaN Wide Bandgap, "The Future of Power"

GaN & SiC Session - January 2024

Here is the recording of our Live Q&A (L9) from my Wide Bandgap Online Event on the third day.

Advanced Capacitor Technologies

Here is the recording of our Live Q&A (L12) from my Wide Bandgap Online Event on the fourth day.

Efficient, Economical Choices of Magnetic Materials for SiC an GaN designs

Here is the recording of our Live Q&A (L8) from my Wide Bandgap Online Event on the third day.

Faster WBG device characterization for improved time-to-market

Benefits of .XT interconnection technology for Discrete Power devices

Simulating Conducted EM Emissions from Power Electronics

3D printed liquid cooled heatsinks for power electronics applications

Gate Driver Auxiliary Supply for SiC-based applications

Accurate Real-Time Simulation of Converters with Frequent Current Commutation Using Sub-Step Events

Passive Component Advances for Wide Bandgap Semiconductors

Here is the recording of our Live Q&A (L11) from my Wide Bandgap Online Event on the fourth day.

Magnetics Optimization – The fast and reliable way

The Power of Wide Bandgap Semiconductors

E-CAP™: The Next Frontier in Capacitor Technology

Passives for Power: Measuring with Large Signal Excitation

GaN IC Roadmaps

GaN, SiC or traditional silicon? Be technology agnostic to get the best for your application

Making GaN fit for industrial applications