Predicting Curing Behavior with the Kinetics Neo Software
The NETZSCH Kinetics Neo software can not only be used for the analysis of temperature-dependent processes using thermal analysis instruments. It is now also possible to simulate rheological properties during curing with the help of our Kinexus rotational rheometer. Learn more about the kinetic analysis of the curing behavior of a 2-component epoxy adhesive.
Presenter: Dr. Elena Moukhina, "Software Neo" Business Field Manager, NETZSCH-Gerätebau GmbH
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Find out more about Kinetics Neo and Termica Neo here:
https://kinetics.netzsch.com/
https://termica.netzsch.com/
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