Logitech LP70 • Multi-Station Lapping & Polishing System
Overview
This Logitech bench-top machine is designed to run concurrent automated processes, allowing operators to achieve repeatable results to stringent sample specifications. With four workstations as standard, this system is the optimal solution for both production environments and research laboratories.
• Four workstations with a wafer capacity up to 4” or two 6” wafers
• Bluetooth automatic plate-flatness monitor
• Real-time data collection
• Plate speed: 5 – 100rpm
• Driven jig technology: 5 – 100rpm
• Manual and recipe modes for process development / automated process runs controlled via touchscreen
• Bluetooth Endpoint thickness control for both lapping and polishing
• Chemically resistant option available
• Up to 3 peristaltic pumps for metered delivery of lapping and polishing solutions
• Safety interlocks to prevent access to the process area during processing
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