Integrated circuit 3D imaging
Supplementary movies from the paper "High-resolution non-destructive three-dimensional imaging of integrated circuits" authored by Mirko Holler, Manuel Guizar-Sicairos, Esther H. R. Tsai, Roberto Dinapoli, Elisabeth Müller, Oliver Bunk, Jörg Raabe & Gabriel Aeppli, published in Nature 543, 402–406 (16 March 2017) doi:10.1038/nature21698 http://dx.doi.org/10.1038/nature21698
"X-ray ptychography—a high-resolution coherent diffractive imaging technique—can create three-dimensional images of integrated circuits of known and unknown designs with a lateral resolution in all directions down to 14.6 nanometres. [A] major advance in chip inspection and reverse engineering over the traditional destructive electron microscopy and ion milling techniques."
Video 1: 3D rendering of the detector ASIC.
Video 2: 3D rendering of the Intel® chip.
Video 3: Axial slices of the Intel® chip.